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By Alvin Lieberman

Contamination keep an eye on criteria and methods for all stages of the construction of high-technology items are spelled out during this applications-orientated consultant. functional cleansing equipment for items and approach fluids are observed by means of tips about picking operations in line with financial system and potency. factors of contaminant size units hide operation, blunders resources and remedial equipment. Engineers will locate important facts on contaminant assets, in addition to assurance of operations and systems that irritate contaminant effects.

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Extra resources for Contamination Control and Cleanrooms: Problems, Engineering Solutions, and Applications

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Sizing Particles at High Sensitivity in High Molecular Scattering Environments. Proceedings of the 3rd Institute of Environmental Science Annual Technical Meeting, pp. 428-435, May 1987, San Jose, CA. Koellen, D. , & Saxon, D. , 1985. Application of Surface Analysis: Detection and Identification of Contamination on Semiconductor Devices. Microcontamination 3(7):47-55. , 1971. Cornparison of Continuous Measurernent of Interior and Exterior Aerosol Levels. Paper read at Arnerican Industrial Hygiene Association Conference, May 24,1971, Toronto.

Microcontamination 4(10):45-50. , 1982. Private communication. , 1962. Contamination Effects Study. ARF 3216-5. Armour Research Foundation Report to Sandia Corp. , & Ogle, H. , 1971. Particle Generation in Computer Memory Systems. Proceedings of the International Powder Technology and Bulk Solids Conference, pp. 99-102, London. Monkowski, J. , 1984. Significance of Submicrometer Particles to Device Performance. Proceedings of the 30th Annual Technical Meeting, Institute of Environmental Sciences, pp.

Surface migration to sensitive locations d. Particle growth to hazardous size by agglomeration e. Secondary abrasion by fragments 3. Energy gradient effects a. Electrostatic discharges b. Material degradation at high temperature c. Bacterial growth B. Particle contaminant prompt effects 1. Hard particle wear, physical interference, etc. 2. Soft particle deposition and resulting dimensional changes, weight imbalance, motion interference, etc. C. Particle-substrate energy transfer 1. Electromagnetic energy 2.

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